Title:

IC Packaging Engineer

Location:

Cambridgeshire

Salary:

Competitive salary + benefits

Description:

Our successfully growing client now requires an IC Packaging Engineer to be involved with designing semiconductor packages (WLCSP, BGA, LGA and MCM) and new product introduction as well as interacting between the design department and subcontractors. The role will also involve being responsible for ensuring the manufacturability of the products and the smooth transfer of the product from development to product engineering.Required skills include:-Good knowledge of IC semiconductor packaging, quality and failure analysis disciplines-Experience of working within a high volume semiconductor manufacturing environment-Ability to work with various departments within the company-Far Eastern subcontractor experience desirable-Degree or equivalent qualificationsPlease call us to discuss further.