Description: |
Our Client is a major supplier of Bluetooth devices and is seeking top quality candidates for all their technicalpositions.Applicants must be willing to provide evidence of eligibility to work in the UK if requested.The Package Design Engineer's role involves interacting with the company's subcontractors to design semiconductorpackages that interface between the bare silicon die and the product in which they are used. This role is based in ourclients design department.The role encompasses the design of WLCSP, BGA, LGA and multi-chip module packages, to support the company's growingproduct range. This activity will require working with the company's subcontractors, ASIC design, ASIC layout, Marketing,Applications and Product Engineering groups to achieve the optimum package design. The successful candidate will beresponsible for ensuring the manufacturability of products and the smooth transfer of the product from Development toProduct Engineering.The candidate will be required to use PCB/IC design tools and manipulate netlists to design and verify package designs.An understanding of semiconductor packaging materials, processes and reliability would be advantageous. The positionrepresents a unique opportunity to assist with the introduction and volume ramp of company WiFi products and theindustry's first single chip Bluetooth family with exposure to RF, analogue, digital and embedded NVM technology in asingle CMOS integrated circuit.Responsibilities include:Optimising the package design for performance, manufacturability and market requirementsPerforming formal package design reviewsDocumenting new package designsDissemination of new package designs to the Technical Communications groupTransferring new package designs into productionDirecting the constructional analysis of assembled packagesIdeally the candidate will have 3-5 years' experience in packaging in a high volume, mixed-signal IC productionenvironment. A minimum of a degree in electronics, CAD or a related subject is required. |
